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Snapdragon 865 Plus vs Dimensity 1000

We compared two 8-core processors: Qualcomm Snapdragon 865 Plus (with Adreno 650 graphics) and MediaTek Dimensity 1000 (Mali-G77 MP9). Here you will find the pros and cons of each chip, technical specs and comprehensive tests in benchmarks like AnTuTu and Geekbench.

Review

General comparison of performance, power consumption and other indicators
CPU Performance
Single and multi-core processor tests
Gaming Performance
GPU performance in games and OpenCL/Vulcan
Battery life
Efficiency of battery consumption
NanoReview Score
Overall chip score

Key Differences

Main differences and advantages of each chip
Pros of Qualcomm Snapdragon 865 Plus
  • Developers optimize games for Snapdragon processors more often than for Dimensity
  • Supports 47% higher memory bandwidth (44 against 29.87 GB/s)
  • 19% higher CPU clock speed (3100 vs 2600 MHz)
  • Shows better (up to 22%) AnTuTu 8 score – 616K vs 505K
  • Announced 8 months later
Pros of MediaTek Dimensity 1000
  • Better instruction set architecture

Benchmarks

Performance tests in popular benchmarks
Geekbench 5 (Single-Core)
Geekbench 5 (Multi-Core)
AnTuTu Benchmark 8
616628

Specifications

Full list of technical specifications of Snapdragon 865 Plus and Dimensity 1000

CPU

Architecture 1x 3.1 GHz – Kryo 585 Prime (Cortex-A77)
3x 2.42 GHz – Kryo 585 Gold (Cortex-A77)
4x 1.8 GHz – Kryo 585 Silver (Cortex-A55)
4x 2.6 GHz – Cortex-A77
4x 2 GHz – Cortex-A55
Cores 8 8
Frequency 3100 MHz 2600 MHz
Instruction set ARMv8.2-A ARMv8.3-A
L1 cache 512 KB -
L2 cache 1 MB -
L3 cache 4 MB -
Process 7 nanometers 7 nanometers

Graphics

GPU name Adreno 650 Mali-G77 MP9
Architecture Adreno 600 Valhall
GPU frequency 645 MHz -
Cores - 9
Number of ALUs 384 -
Vulkan version 1.1 1.1
OpenCL version 2.0 2.0
DirectX version 12 12

Memory

Memory type LPDDR5 LPDDR4X
Memory frequency 2750 MHz 1866 MHz
Bus 4x 16 Bit 4x 16 Bit
Max bandwidth 44 Gbit/s 29.87 Gbit/s
Max size 16 GB 16 GB

Multimedia (ISP)

Neural processor (NPU) Hexagon 698 Yes
Storage type UFS 3.0, UFS 3.1 UFS 3.0
Max display resolution 3840 x 2160 2520 x 1080
Max camera resolution 1x 200MP, 2x 25MP 1x 80MP, 2x 32MP
Video capture 8K at 30FPS, 4K at 60FPS 4K at 30FPS
Video playback 8K at 30FPS 4K at 30FPS
Video codecs H.264, H.265, VP8, VP9 H.264, H.265, AV1, VP9
Audio codecs AAC, AIFF, CAF, MP3, MP4, WAV AIFF, CAF, MP3, MP4, WAV

Connectivity

Modem X55 -
4G support LTE Cat. 24 LTE Cat. 20
5G support Yes Yes
Download speed Up to 2500 Mbps Up to 4700 Mbps
Upload speed Up to 316 Mbps Up to 2300 Mbps
Wi-Fi 6 6
Bluetooth 5.2 5.1
Navigation GPS, GLONASS, Beidou, Galileo, QZSS, SBAS GPS, GLONASS, Beidou, Galileo

Info

Announced July 2020 November 2019
Class Flagship Flagship
Model number SM8250-AB -
Official page Qualcomm Snapdragon 865 Plus official site MediaTek Dimensity 1000 official site

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Comments

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