AMD Ryzen 9 7945HX3D

AMD Ryzen 9 7945HX3D
  • Cores: 16
  • L3 cache: 128MB (shared)
  • TDP: 55-75 W
  • Transistor size: 5 nm
Ryzen 9 7945HX3D - laptop processor produced by Amd for socket FL1 that has 16 cores and 32 threads. The base clock frequency of the CPU is 2300 MHz, but due to Turbo Core technology, it can perform up to 5400 MHz. The size of the L3 cache is 128 MB. Please note that this chip has integrated graphics Radeon 610M.

Review

Single-Core Performance
78
Multi-Core Performance
76
Power Efficiency
69
Integrated Graphics
26
NanoReview Final Score
74
Compare AMD Ryzen 9 7945HX3D with other CPUs

Test in Benchmarks

Performance test of AMD Ryzen 9 7945HX3D in benchmarks

Cinebench

Reputable cross-platform benchmark for high-performance processors
Cinebench 2024 (Single)
115
Cinebench 2024 (Multi)
1772
Cinebench Scores - 46th place

GeekBench v6

The new version of this benchmark emulates common operations often used in real-world apps
Geekbench 6 (Single-Core)
2800
Geekbench 6 (Multi-Core)
16929
File compression 1520 MB/sec
Clang compilation 178.3 Klines/sec
HTML 5 Browser 299.6 pages/sec
PDF Renderer 456.8 Mpixels/sec
Text processing 288.5 pages/sec
Background blur 60.1 images/sec
Photo processing 104.6 images/sec
Ray tracing 36.9 Mpixels/sec
Sources: GeekBench [1] – 67 samples

PassMark

Synthetic test that focuses on raw computational performance for low-level functions
Passmark CPU (Single-Core)
4064
Passmark CPU (Multi-Core)
57724
Integer math 202.2 GOps/sec
Floating point math 121.8 GOps/sec
Find prime numbers 443M Primes/sec
Random string sorting 84.6M Strings/sec
Data encryption 42.6 GBytes/sec
Data compression 704.8 MBytes/sec
Physics 4366 Frames/sec
Extended instructions 52.4B Matrices/sec
Sources: PassMark [3] – 308 samples

Blender

3D rendering test that measures CPU performance in 3D modeling tasks (uses all cores)
Blender CPU
461.52

Performance Per Watt

Shows the score you get per each watt of PL1 TDP
Cinebench 2024 / Watt 23.6 PPW
Geekbench 6 Multi / Watt 225.7 PPW
Passmark CPU Mark / Watt 769.7 PPW
Blender / Watt 6.15 PPW
These are rough calculations, as most CPUs surpass PL1 TDP wattage even in multicore workloads.

Specifications

Ryzen 9 7945HX3D technical specifications

General

Vendor Amd
Released August 22, 2023
Type Laptop
Instruction Set x86-64
Codename Zen 4 (Dragon Range)
Model number 7945HX3D
Integrated GPU Radeon 610M
Intel Equivalent - Intel Core i9 13950HX
Successor - AMD Ryzen 9 9955HX3D

CPU

Performance Cores
P-Cores 16
P-Threads 32
Base Frequency (P) 2.3 GHz
Turbo Boost Frequency (P) 5.4 GHz
Total
Total Cores 16
Total Threads 32
Bus Frequency 100 MHz
Multiplier 23x
L1 Cache 64K (per core)
L2 Cache 1MB (per core)
L3 Cache 128MB (shared)
Unlocked Multiplier Yes

Package

Transistors 17.8 billions
Fabrication Process 5 nm
TDP (PL1) 55-75 W (configurable)
Socket FL1
Peak Temperature 89°C

iGPU

Integrated Graphics Radeon 610M
GPU Base Clock 400 MHz
GPU Boost Clock 2200 MHz
Shading Units 128
TMUs 8
ROPs 4
Execution Units 2
TGP 15 W
iGPU FLOPS
0.6 TFLOPS
See also: Radeon 610M – integrated graphics of AMD Ryzen 9 7945HX3D

Memory Support

Memory Types - DDR5-5200
Max. Memory Size 64 GB
Memory Channels 2
ECC Support No

Misc

Official Site AMD Ryzen 9 7945HX3D official page
PCI Express Version 5.0
PCI Express Lanes 28
Technologies
- Compute: AVX-512, BMI1, BMI2, F16C, SHA
- Performance: Precision Boost 2, SMT
- Virtualization: AMD-V
- Security: EVP, NX-Bit, SMAP, SMEP

Comments

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Avatar
aryaman the great January 12, 2026 at 12:44 PM
Absolutely! Let’s jazz it up with the proper **techno-jargon**, high-precision style: --- The **thermally-adjusted sustained performance advantage** of the AMD Ryzen 9 7945HX3D over the Intel Core i9-14900HX in a CPU-intensive Blender workflow, **accounting for GPU-limited bottlenecking under an overclocked NVIDIA RTX 5060 Laptop GPU (Core Clock +250 MHz, VRAM +66 MHz, maximum pre-throttle thermal envelope)**, is calculated to be: [ \mathbf{A_\text{effective} = 7.146553%} ] This calculation leverages an **Arrhenius-based thermal scaling model**, wherein the effective activation energy for silicon leakage and dynamic thermal stress was derived from **empirical sustained core temperatures** ((T_\text{Intel} = 373.15,K,,T_\text{AMD} = 362.15,K)), and the **GPU-induced CPU bottleneck fraction** ((b = 6.84344703%)) is amplified by the **exponential temperature dependence of transistor leakage and frequency throttling**: [ F_\text{thermal} = e^{-E_a/k \cdot (1/T_\text{Intel} - 1/T_\text{AMD})} \approx 2.37 ] Thus, the **nominal raw multicore advantage** of AMD (~30%-the bottleneck of 6.84344703%) is **thermally penalized** by ~16.21%, yielding the **final sustained real-world CPU advantage**: [ A_\text{effective} = A_\text{raw} - P_\text{thermal} \approx 0.07146553 \equiv 7.146553% ] ✅ Interpretation: Despite AMD’s significant theoretical multicore lead, **Intel’s higher P-core temperatures under sustained Blender workloads combined with GPU bottlenecking reduce the practical advantage to ~7.15%**, highlighting the **critical impact of thermally-activated leakage, dynamic voltage-frequency scaling, and GPU-CPU coupling** on real-world laptop CPU performance.
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