AMD Radeon 820M vs Adreno X2-45
AMD Radeon 820M
Krackan Point
Adreno X2-45
Adreno X2
We compared two integrated laptop GPUs: the Radeon 820M with 2 pipelines and 128 shaders against the 9 months newer Adreno X2-45 that utilizes 1152 shaders. Here you will find complete details about specs, efficiency, performance tests, and more.
Review
Gaming
Performance in DirectX, OpenCL, and Vulkan games
Workstation
Perf. in 3D modeling, video editing and rendering apps
Energy Efficiency
Power consumption efficiency in different scenarios
NanoReview Final Score
Overall video card score
Scores marked with a red asterisk (**) represent initial estimates from early testing.
Key differences
Reasons to consider the Adreno X2-45
- 5.6x higher maximum theoretical performance (3.9 vs 0.7 TFLOPS)
- Manufactured using a more efficient 3 nm process technology
- Has 9x more shading units (1152 vs 128)
Benchmarks
Graphics cards’ performance in recent benchmarking appsPassmark Graphics
G3D Mark Score
| G2D Mark | 756 | - |
| DirectX 11 | 21 FPS | - |
| DirectX 12 | 10 FPS | - |
| GPU Compute | 986 Ops/s | - |
Specifications
Technical specifications of Radeon 820M and Adreno X2-45General
| Vendor | Amd | Qualcomm |
| Build | Integrated | Integrated |
| Released | January 6, 2025 | September 25, 2025 |
| Case | Laptop | Laptop |
| Purpose | Generic | Generic |
| Segment | Entry-level | Entry-level |
| Architecture | RDNA 3.5 | Adreno X2 |
| GPU Codename | Krackan Point | Adreno X2 |
| Rival Equivalent | - Intel Xe3 Graphics (2-Core) | - |
| Recommended CPU | - AMD Ryzen AI 5 330 or above | - Qualcomm Snapdragon X2 Plus (X2P-64-100) or above |
| Used in CPUs | - AMD Ryzen AI 5 330 | - Qualcomm Snapdragon X2 Plus (X2P-64-100) - Qualcomm Snapdragon X2 Plus (X2P-42-100) |
Laptop GPU ranking (62nd and 27th place)
Graphics Processing Unit
| Base Clock | 400 MHz | 500 MHz |
| Boost Clock | 2800 MHz | 910-1700 MHz (configurable) |
| Shading Units | 128 | 1152 |
| Texture Mapping Units (TMUs) | 8 | 72 |
| Render Output Units (ROPs) | 4 | 36 |
| Compute Units (Pipelines) | 2 | - |
| Tensor Cores | No | No |
| Ray-tracing Cores | 2 | - |
| L1 Cache | 128KB per cluster | - |
| L2 Cache | 1MB shared | - |
| Instructions Per Cycle | 2 IPC | 2 IPC |
Raw Performance
| Pixel Fill Rate | 11 GPixel/s | 33-61 GPixel/s |
| Texture Fill Rate | 22 GTexel/s | 66-122 GTexel/s |
FLOPS (FP32)
Physical
| Interface | PCIe 4.0 x8 | IGP |
| TGP | 15 W | - |
| Manufacturing | TSMC | TSMC |
| Fabrication Process | 4 nm | 3 nm |
| Die Size | 195 mm² | 220 mm² |
| Max. Temperature | 100°C | - |
Memory
| Memory Type | System Shared | System Shared |
| Bus | - | 128-bit |
| ECC | No | No |
Memory Bandwidth
API
| DirectX | 12 | 12.2 |
| Vulkan | 1.4 | 1.4 |
| OpenGL | 4.6 | - |
| OpenCL | 2.1 | 3.0 |
| CUDA | No | No |
| Ray Tracing | Yes | Yes |
| DLSS | No | No |
| DisplayPort | 2.1 | 1.4 |
Cast your vote
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