HiSilicon Kirin 810

HiSilicon Kirin 810 – an 8-core chipset that was announced on June 21, 2019, and is manufactured using a 7-nanometer process technology. It has 2 cores Cortex-A76 at 2200 MHz and 6 cores Cortex-A55 at 1900 MHz.

CPU Performance

49

Gaming Performance

35

Battery life

90

NanoReview Score

55

Benchmarks

Performance tests in popular benchmarks

Geekbench 4 (Single-Core)

2856

Geekbench 4 (Multi-Core)

7958

AnTuTu Benchmark 8

235107

Specifications

Detailed specifications of the Kirin 810 SoC with Mali-G52 MP6 graphics

CPU

Architecture	2x 2.2 GHz – Cortex-A76 6x 1.9 GHz – Cortex-A55
Cores	8
Frequency	2200 MHz
Instruction set	ARMv8.2-A
L1 cache	256 KB
L2 cache	1 MB
Process	7 nanometers
Transistor count	6.9 billion

Graphics

GPU name	Mali-G52 MP6
Architecture	Rogue
GPU frequency	820 MHz
Cores	6
Vulkan version	1.1
OpenCL version	2.0
DirectX version	12

Memory

Memory type	LPDDR4X
Memory frequency	2133 MHz
Bus	4x 16 Bit
Max size	8 GB

Multimedia (ISP)

Neural processor (NPU)	Yes
Storage type	eMMC 5.1, UFS 2.1
Max display resolution	3840 x 2160
Max camera resolution	1x 48MP, 2x 20MP
Video capture	4K at 30FPS
Video playback	4K at 60FPS
Video codecs	H.264, H.265
Audio codecs	AIFF, CAF, MP3, MP4, WAV

Connectivity

4G support	LTE Cat. 12
5G support	No
Download speed	Up to 600 Mbps
Upload speed	Up to 150 Mbps
Wi-Fi	6
Bluetooth	5.0
Navigation	GPS, GLONASS, Beidou, Galileo

Info

Announced	June 2019
Class	Mid range