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HiSilicon Kirin 810

HiSilicon Kirin 810

HiSilicon Kirin 810 – an 8-core chipset that was announced on June 21, 2019, and is manufactured using a 7-nanometer process technology. It has 2 cores Cortex-A76 at 2200 MHz and 6 cores Cortex-A55 at 1900 MHz.

CPU Performance
57
Gaming Performance
44
Battery life
90
NanoReview Score
61

Benchmarks

Performance tests in popular benchmarks
Geekbench 5 (Single-Core)
610
Geekbench 5 (Multi-Core)
2048
AnTuTu Benchmark 8
326999

Specifications

Detailed specifications of the Kirin 810 SoC with Mali-G52 MP6 graphics

CPU

Architecture 2x 2.2 GHz – Cortex-A76
6x 1.9 GHz – Cortex-A55
Cores 8
Frequency 2200 MHz
Instruction set ARMv8.2-A
L1 cache 256 KB
L2 cache 1 MB
Process 7 nanometers
Transistor count 6.9 billion

Graphics

GPU name Mali-G52 MP6
Architecture Rogue
GPU frequency 820 MHz
Cores 6
Vulkan version 1.1
OpenCL version 2.0
DirectX version 12

Memory

Memory type LPDDR4X
Memory frequency 2133 MHz
Bus 4x 16 Bit
Max size 8 GB

Multimedia (ISP)

Neural processor (NPU) Yes
Storage type eMMC 5.1, UFS 2.1
Max display resolution 3840 x 2160
Max camera resolution 1x 48MP, 2x 20MP
Video capture 4K at 30FPS
Video playback 4K at 60FPS
Video codecs H.264, H.265
Audio codecs AIFF, CAF, MP3, MP4, WAV

Connectivity

4G support LTE Cat. 12
5G support No
Download speed Up to 600 Mbps
Upload speed Up to 150 Mbps
Wi-Fi 6
Bluetooth 5.0
Navigation GPS, GLONASS, Beidou, Galileo

Info

Announced June 2019
Class Mid range

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